Zero Emissions Fab Gate at Silicon Saxony Days 2026

How can emissions, water consumption, and resource requirements in the semiconductor industry be sustainably reduced? At the Zero Emissions Fab Gate, experts from industry, research, and plant engineering will discuss current challenges and innovative solutions—ranging from CF₄ abatement and carbon footprints to water recycling, resilience, and sustainable process management.

Look forward to practical presentations, international perspectives, and networking opportunities centered on the sustainable fab of the future

11:05 – 11:15 a.m.

Welcome & Introduction

Dr. Guy Davies, DAS Environmental Expert GmbH

Brief introduction to the objectives of the “Zero Emissions Fab Gate” and the key sustainability topics shaping the semiconductor industry.

11:15 – 11:45 a.m.

Beyond Industry Benchmarks: Raising CF₄ Abatement Efficiency Standards in Semiconductor Manufacturing

Falk Allmrodt, DAS Environmental Expert GmbH

How high must actual abatement efficiency be in the future to meet global climate targets? This presentation analyzes international CF₄ emission data and demonstrates why best-in-class waste gas treatment is not only environmentally essential, but also economically beneficial – especially in the context of growing carbon pricing systems.

11:45 – 12:15 p.m.

Semiconductor Wastewater: From Treatment to Recycling and Resource Recovery

Dr. Anita Haupt, DAS Environmental Expert GmbH

Using practical examples from the semiconductor industry, this presentation introduces modern industrial wastewater treatment technologies – ranging from biological and chemical-physical treatment processes to membrane technologies for water reuse and resource recovery.

12:15 – 12:45 p.m.

Water Project Delivery and Process Challenges for High Tech and Mega Facilities

Kiran Thota, Micron Technology

Insights into the challenges and key success factors involved in implementing complex water projects for high-tech and mega facilities.

12:45 – 2:00 p.m.

Lunch Break & Networking Time

Time for networking, professional exchange, and discussions.

2:00 – 2:30 p.m.

Process Data to Actionable Carbon Footprints in Semiconductor Manufacturing

Catherine Marsan-Loyer, C2MI

How can process data be translated into actionable product carbon footprints? Using certified PCF models, this presentation demonstrates how key emission drivers can be identified and how sustainable optimization measures – such as water recycling and bio-based materials – can be implemented.

2:30 – 3:00 p.m.

Water Resilience Across the AI Value Chain: From Advanced Fabs to Hyperscale Data Centers

Hartmut Schneider, exyte

Water availability is becoming a critical factor across the entire AI value chain – from advanced semiconductor fabs to hyperscale data centers.

3:00 – 3:30 p.m.

Advancing Water Sustainability through Tool-Facility Integration

Harold Stroke, SCREEN

How can process tools and facility systems work together to reduce water consumption? Using digital fab models, this presentation demonstrates how intelligent integration, data transparency, and optimized recirculation can measurably reduce freshwater demand in modern fabs.

3:30 – 4:00 p.m.

Sustainability Management: Navigating Challenges in Evaluating & Optimizing from CMP to Plasma Etch

Katharina Lilienthal, Fraunhofer IPMS

From data collection and energy consumption to water and waste management, this presentation highlights the challenges of sustainable process evaluation throughout semiconductor manufacturing and identifies opportunities for optimization and resource savings.

4:00 – 4:15 p.m.

Closing Remarks & Prize Draw

Dr. Guy Davies, DAS Environmental Expert GmbH

Closing session of the Zero Emissions Fab Gate with a summary of key insights followed by the prize draw for exclusive prices.